| 发明名称 |
ARRAYING METHOD FOR SEMICONDUCTOR PELLETS |
| 摘要 |
<p>PURPOSE:To obtain highly positioned pellet configuration by holding the circumferential edges of a flexible sheet affixed thereto with a multiplicity of diced semiconductor pellets and stretching said sheet with a heting body after evenly heating the sheet by flowing hot air.</p> |
| 申请公布号 |
JPS52135666(A) |
申请公布日期 |
1977.11.12 |
| 申请号 |
JP19760052976 |
申请日期 |
1976.05.10 |
| 申请人 |
TOKYO SHIBAURA ELECTRIC CO |
发明人 |
KATAOKA HIROSHI |
| 分类号 |
H01L21/67;H01L21/301;H01L21/68;H01L21/78 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
