| 摘要 |
The wire, ribbon, or the like, is repetitively bent back and forth until it breaks, the bending being, preferably, effected rapidly, for example by means of an electromagnet fed, for example, with line frequency alternating current. The wire is guided in a guide tool which deflects the wire transversely to its axis rapidly back and forth, thus effecting breaking within about one second of application of bending stresses. This is particularly useful to sever tiny wires, in the order of 100 mu m diameter, as connecting leads in semiconductor and thin film technology. |
