| 摘要 |
This invention is concerned with the production of glasses especially suitable for the encapsulation of semiconductor devices and, in particular, for the encapsulation of germanium and silicon diodes. The glasses have a low softening point, i.e., less than about 550 DEG C., are readily sealable to Dumet, and exhibit a viscosity at the liquidus of at least 20,000 poises. The glasses have compositions within the K2O-PbO-B2O3-SiO2 system, are essentially free from Li2O, Na2O, Al2O3, and TiO2, and demonstrate a mismatch in thermal expansion with Dumet at about 400 DEG C. of no more than about 200 PPM. |
