| 摘要 |
A substrate assembly for an electronic circuit has multilayered wirings each of which comprises a thin titanium film either on a substrate or on an insulator layer, a thin nickel film on the titanium film, and a wiring film on the nickel film with the insulator layer covering the wiring films with predetermined areas thereof uncovered. The wiring films may be of gold or rhodium and may comprise a thin palladium film between one each of the nickel and gold or rhodium films. The titanium and nickel films are formed according to thin-film techniques. The wiring films are formed by selective plating. The insulator layer or layers are formed according to thick-film techniques. |
