发明名称 |
Self-aligning package for integrated circuits |
摘要 |
A self-aligning integrated circuit package includes an integrated circuit die having raised contact pads mounted to an interconnecting die in flip chip fashion. The interconnecting die is formed of anodizable material and has raised anodized portions that form guide means for aligning the integrated circuit die and the leads of a lead frame so that they are positioned over conductive portions of the interconnecting die which connect the contact pads of the integrated circuit to the leads of the lead frame.
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申请公布号 |
US4056681(A) |
申请公布日期 |
1977.11.01 |
申请号 |
US19750601854 |
申请日期 |
1975.08.04 |
申请人 |
INTERNATIONAL TELEPHONE AND TELEGRAPH CORPORATION |
发明人 |
COOK, JR., CHARLES R. |
分类号 |
H01L21/316;H01L21/48;H01L21/60;H01L23/31;H01L23/498;(IPC1-7):H05K5/00 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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