| 摘要 |
PURPOSE: To provide a substrate contact point stud, having low electric migration characteristics without void, by comprising a first metal layer which, reaction with substrate material for sticking, is so deposited as to fill-up the hole of an insulation layer, a second metal layer of fire-proof metal deposited over it, and a third metal layer of fire-proof metal deposited over it. CONSTITUTION: An insulation body is deposited all over a substrate 1. Then, with the insulation body flattened, each part is selectively removed at a pre-determined position for a substrate surface for contact point to be exposed. Then, a reactive sticking layer 15 is deposited all over the insulation body and a contact point hole 5, and a crystal seed layer 21 is deposited on the sticking layer 15. These both layers are stuck by spattering with the sticking layer 15 being transition metal capable of reducing SiO2 , in addition, the crystal seed layer 21 preferred to be fire-proof metal. Then, fire-proof metal such as tungsten is chemically grown in gaseous atmosphere for completing formation of a contact point stud as a filler layer 17. |
