发明名称 |
PLASTIC MOLDED SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE:To evade the breakdown of pellets and the disconnection of wires by so designing a metal support plate as to restrain the resin around semiconductor pellet and the vicinity of wires thereby reducing the displacement owing to thermal expansion of the resin. |
申请公布号 |
JPS52129379(A) |
申请公布日期 |
1977.10.29 |
申请号 |
JP19760045498 |
申请日期 |
1976.04.23 |
申请人 |
HITACHI LTD |
发明人 |
YAMAGUCHI MASAO;IMAI JIYOUGA;KANBAYASHI KAZUO |
分类号 |
H01L23/48;H01L23/02;H01L23/12;H01L23/28 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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