发明名称 |
COMPOSITE PAD |
摘要 |
<p>The composite underlay provides adhesion for fixing an orthodontal device on a tooth. The underlay consists of a non-porous metal foil used for mounting the device and bonded to a metal mesh holding binder for bonding the underlay to a tooth. These parts are pref. joined together by diffusion welding or hard solder. The foil is pref. 0. 18 mm thick and the mesh made of wire 0.11 mm dia. with mesh pitch 0.25 mm. Both are pref. made of stainless steel. When the two parts are to be joined by diffusion welding, the mesh wires arepref. provided with flattened joint surfaces.</p> |
申请公布号 |
JPS52126994(A) |
申请公布日期 |
1977.10.25 |
申请号 |
JP19770042767 |
申请日期 |
1977.04.15 |
申请人 |
MILLER FRANK R;ANDREIKO CRAIG A |
发明人 |
FURANKU AARU MIRAA;KUREIGU EI ANDOREIKO |
分类号 |
A61C7/14;A61C7/16;A61C7/28 |
主分类号 |
A61C7/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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