Combined semiconductor device and printed circuit board assembly

摘要

A method for combining a semiconductor device with a printed circuit board or substrate which eliminates the need for conventional semiconductor packaging and connectors for same on the board and thereby makes possible a relatively small and thin assembly adaptable for space limited electronic products. The semiconductor device is fixed to a carrier which is installed and secured within a hold in the circuit board. Terminal pads of the device are wire bonded to terminals on the substrate, and the connecting wires and die are completely encapsulated within a plastic material.