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发明名称
BONDING METHOD OF SEMICONDUCTOR PELLET AND HEADER
摘要
PURPOSE:To improve the reliability of junction by gold-plating of surface roughness 0.7 to 2.5 on a header and fusing this face to a pellet by T u - si eutectic.
申请公布号
JPS52122473(A)
申请公布日期
1977.10.14
申请号
JP19760038259
申请日期
1976.04.07
申请人
发明人
分类号
H01L21/52;H01L21/58
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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