| 摘要 |
A method of depositing a metal on a surface of a substrate is disclosed. The method comprises selectively coating portions of the surface with a colloidophobic material to render the portions colloidophobic and to delineate an exposed surface pattern which is capable of retaining a colloidal species thereon. The selectively coated surface is treated with a sol comprising a colloidal species selected from the group comprising (1) a species capable of reducing an activating metal ion to an activating metal, and (2) a colloidal activating metal species capable of participating in an electroless metal deposition to deposit the colloidal species on the exposed surface pattern. |
