| 摘要 |
<p>PURPOSE:To enable positional correction of a wafer or a semiconductor chip by capturing, with a camera for recognition, only the transmitted light which has transmitted the sheet around a water or a semiconductor chip. CONSTITUTION:A sheet 2, which is attached to a wafer or a semiconductor chip 1 and can transmit light, is fixed onto a sheet fixing ring 3, which is fixed to a fixing table 5 fixed onto an X-Y-theta table 4. And a camera 7 for recognition receives the light, which has transmitted a sheet 2 around a wafer or a semiconductor chip 1, and based on the signal received with a recognition device 8, the position of a wafer or a semiconductor chip 1 is calculated. And a corrector 9 calculates the compensation quantity, and an X-Y-theta table controller 10 controls the X-Y-theta table 4 based on the compensation quantity. Hereby, the position of the wafer or the semiconductor chip 1 can be compensated.</p> |
