Sputtering apparatus

摘要

A sputtering apparatus of the bell-jar type includes a high-vacuum pump disposed centrally of, and directly within a vacuum chamber of the apparatus. A separate enclosing member is disposed within the chamber and allows selective exposure of the pump to the chamber. An annular workholder is mounted in concentric surrounding relation with the pump, and an apertured, annular shutter is mounted in concentric surrounding relation with the workholder. Targets of materials to be sputter deposited on the workpieces are mounted on the inside wall of the main enclosure of the apparatus. The shutter and the workholder are moved in synchronism at the beginning and at the end of the deposition cycle to provide a uniform exposure of all the workpieces to the targets.