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发明名称
SEALING METHOD FOR SEMICONDUCTOR DEVICES
摘要
申请公布号
JPS52115181(A)
申请公布日期
1977.09.27
申请号
JP19760031421
申请日期
1976.03.24
申请人
HITACHI LTD
发明人
MURATA AKIRA;ISHI ICHIROU
分类号
H01L23/02;H01L23/12
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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