| 发明名称 |
SCRIBING METHOD OF SEMICONDUCTOR WAFER |
| 摘要 |
<p>PURPOSE:To prevent cracks at cross point of braking groove by determining both scribing direction and order in accordance with the crystal surface of semiconductor and then by performing scribing through change of cutter load as prescribed.</p> |
| 申请公布号 |
JPS52112273(A) |
申请公布日期 |
1977.09.20 |
| 申请号 |
JP19760028618 |
申请日期 |
1976.03.18 |
| 申请人 |
TOKYO SHIBAURA ELECTRIC CO |
发明人 |
OZAWA SHIGERU |
| 分类号 |
H01L21/301;H01L21/78 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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