| 摘要 |
PURPOSE:To facilitate the direct mounting into a package and automatic assembly by flattening the bottom face of a connecting device provided on a substrate formed with a hybrid IC, and making it leadless. CONSTITUTION:The first conductor 3A, a dielectric substance 4, the second conductor 3B, a resistor 4 and a protector 6 are formed on a ceramic substrate 2 by thick-film printing to constitute a pattern circuit. Electronic components are fitted on the thick-film-printed substrate formed with the pattern circuit to form a hybrid IC, which is installed into a package, the bottom face of a hybrid IC connecting terminal 1 is flattened against the installation pad of the package, thereby direct surface mounting is allowed. The connecting terminal 1 is made leadless, automatic assembly and high-density mounting can be realized, the package side is not damaged, thus the reliability of electric connection can be increased. |
