METHOD OF MANUFACTURING THCKKFILM CIRCUIT

摘要

A process for producing a thick film circuit with terminal elements on an inorganic substrate. A paste of silver powder, copper oxide powder and organic bonding agent is silk screen printed on an inorganic substrate, dried and sintered. Then over preselected locations along individual conductor paths terminal elements are hard soldered. The conductor paths are strongly adhered to the inorganic substrate and the terminal elements are likewise strongly adhered to the individual conductor paths.