发明名称 COPOLYMERIZATION LIQUID FOR COVER AND COVERING SEMICONDUCTOR ELEMENT
摘要 The novel semiconductor device comprises a body made of semiconductor material having at least two regions of opposite conductivity type. Between the regions of opposite conductivity type there is a P-N junction. An end part of at least one P-N junction is exposed on the surface of the body and has a layer of protective coating material directly on the surface of the body and the exposed end part. The protective coating material is a cured reaction product of a silicon-free organic diamine, an organic tetracarboxylic dianhydride and a polysiloxane containing amine terminal groups. It contains repetitive structural units of the following formula: <IMAGE> containing 15 to 40 mol% of intercondensed structural units of the following formula <IMAGE> R, R', R'', Q, x, n and m are defined in the preceding Patent Claim 1.
申请公布号 JPS52109873(A) 申请公布日期 1977.09.14
申请号 JP19770006882 申请日期 1977.01.26
申请人 发明人
分类号 H01L21/312;H01L23/29;H01L23/31 主分类号 H01L21/312
代理机构 代理人
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