Apparatus for sealing plastic films and the like

摘要

There is disclosed herein an improved method and apparatus for plastic sealing/bonding in which a wire element is positioned between two interfacing (plastic) pieces to be sealed/bonded together, wherein one or both of said pieces are wholly plastic or contain a plastic component. With the wire sandwiched and retained between the interfacing surfaces, a voltage is applied to the wire for a predetermined time to cause the wire to heat sufficiently to melt both interfacing surfaces and effect a fusion and formation of a bond.