| 摘要 |
PURPOSE:To reduce the incidence of void in a resin molded solid electrolytic capacitor by a method wherein, when a capacitor element is set in the cavity of a molding mold, the element placing part of a cathode lead wire is positioned on the side of the lower mold with which the bottom face of a resin covering material is formed. CONSTITUTION:An anode lead wire 2 is connected to the anode lead 1a of a capacitor element 1, and after an element placing part 3a, which is formed on the edge part of a cathode lead wire 3, has been attached to the cathode surface 1a of the element 1, the element 1 is set in the cavity of a molding mold 4, synthetic resin is poured into the cavity from the side of an anode lead wire 2, and a resin covering material 9 is formed around the element 1. When a solid electrolytic capacitor is manufactured by bending an anode lead wire 2 and a cathode lead wire 3 toward the bottom face side of the resin covering material 9, the element placing part 3a of the cathode lead wire 3 is positioned on the side of the lower mold 4b, with which the bottom face of the resin covering material 9 is formed, when the element 1 is set in the cavity, and the pouring of synthetic resin into the cavity is conducted from the side of the anode lead wire 2 of the lower mold 4b. |
