发明名称 |
PRAKTISCH WASSERFREIE SILICON- EPOXY-ZUBEREITUNG |
摘要 |
The admixing of a small amount of an organosilicon compound containing at least one siliconbonded hydrogen atom per molecule with curable compositions comprising a hydroxyl-containing organosilicon compound, an epoxy compound and certain catalytic aluminum compounds to improve the performance of the cured composition is disclosed. The improved compositions are especially useful as a resin binder in molding compounds that are used to mold electronic devices. |
申请公布号 |
DE2615689(A1) |
申请公布日期 |
1977.08.25 |
申请号 |
DE19762615689 |
申请日期 |
1976.04.09 |
申请人 |
DOW CORNING CORP. |
发明人 |
TAYLOR LILES,DONALD;WINTON MICHAEL,KEITH |
分类号 |
C08G59/00;C08L63/00;C08L83/00;C08L83/04;(IPC1-7):C08L83/04;C09J3/16;C09D3/82;B32B27/28 |
主分类号 |
C08G59/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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