Process for encapsulating electronic components in plastic

摘要

A method of making a semiconductor device is disclosed in which a plurality of generally parallel conductors are provided, at least one of which has a mounting portion thereon. A semiconductor wafer is coupled to the mounting portion while means are provided for coupling the other conductors to the semiconductor wafer. An integrally molded mass of insulation material embeds the semiconductor wafer, and the mounting portion, as well as the means connecting the conductors to the semiconductor wafer.