| 摘要 |
DRY REPLENISHMENT OF ELECTROLESS PLATING SOLUTIONS This invention is for replenishment of an aqueous electroless plating solution using replenishers essentially free of diluents without decomposing the plating solution. Typical replenisher formulations comprise a combination of a source of metal ions such as cupric sulphate for copper plating solutions and a stabilizer, the stabilizer being in a concentration sufficient to over-stabilize the solution in the immediate vicinity of the plating solution where the replenisher is added, but insufficient, in combination with residual solution stabilizers, to poison the plating solution when thoroughly admixed therewith. Other additives in the replenisher formulation may include complexing agentbrighteners, surfactants and the like. Essentially diluent free replenisher formulations are preferred for replenishment rather than aqueous solutions, as in the prior art, to prevent volume growth. |
