| 发明名称 |
Process for the removal of specific crystal structure defects from semiconductor discs and the product thereof |
| 摘要 |
Process of the removal of point defects and point defect agglomerates from semiconductor discs, which comprises the steps of providing one side of the discs with a mechanical stress field and then subjecting the discs to a heat treatment.
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| 申请公布号 |
US4042419(A) |
申请公布日期 |
1977.08.16 |
| 申请号 |
US19760708235 |
申请日期 |
1976.07.23 |
| 申请人 |
WACKER-CHEMITRONIC GESELLSCHAFT FUR ELEKTRONIK-GRUNDSTOFFE MBH |
发明人 |
HEINKE, WOLFGANG;KIRSCHNER, HELMUT;REIMANN, DETLEF |
| 分类号 |
C30B33/00;H01L21/322;(IPC1-7):H01L21/32;H01L21/32 |
主分类号 |
C30B33/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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