发明名称 |
CONJUNTO SEMICONDUTOR ENCAPSULADO E PASSIVADO E PROCESSO DE FABRICA-LO |
摘要 |
<p>A semiconductor assembly having a semiconductor and conductive lead members secured thereto by conductive metal contact members is passivated by a layer of fused particles of non-conductive glass and encapsulated in a layer of non-conductive plastic. The product combines the best characteristics of a glass passivated semiconductor and a plastic encapsulated semiconductor while avoiding the disadvantages of both.</p> |
申请公布号 |
BR7605354(A) |
申请公布日期 |
1977.08.16 |
申请号 |
BR19767605354 |
申请日期 |
1976.08.16 |
申请人 |
GENERAL INSTR CORP |
发明人 |
GOLDBERG M;VOORHIS W |
分类号 |
H01L23/29;H01L23/31;H01L23/492;(IPC1-7):H01L1/00 |
主分类号 |
H01L23/29 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|