| 摘要 |
1,173,737. Semi-conductor devices. WESTINGHOUSE ELECTRIC CORP. 4 Nov., 1968 [22 Nov., 1967], No. 52087/68. Heading H1K. A semi-conductor element 8 is hermetically sealed in an enclosure comprising a metal base 4 and a resinous header member 6, wherein the upper surface of the base comprises a peripheral bevelled portion 22 and a projection 14 or groove in contact and interlocking with corresponding portions of the lower surface of the header member. The header member is of a thermosetting epoxy resin or a linear polymer moulded on the base and cured in situ. The interlocking projection 14 is in the form of an annular flange which has a groove 24 in at least one side wall 26 to firmly retain the header member, the inclined portion of the groove making an angle 25 of at least 7 degrees with the side wall of the flange which may be convexly curved. The angle between the upper surface 28 and the side walls 26 of the flange is not less than 90 degrees. In another embodiment, Fig. 5 (not shown), the base has a groove (78) into which a flange on the header fits. The semi-conductor element is a diode, and in all configurations has an electrode 13 soldered to the base and the other electrode soldered to a contact 16, and is surrounded by a mass 20 of silicone varnish. |
