发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:The insulation film is coated on semiconductor substrate through CVD method. Then annealing is performed with the cooling velocity with which no heat distortion to give effect to semoconductor device characteristics. As a result, good property semiconductor device, which has no distortion on the interface between insulation film and substrate, can be obtained.</p>
申请公布号 JPS5294775(A) 申请公布日期 1977.08.09
申请号 JP19760011105 申请日期 1976.02.04
申请人 MITSUBISHI ELECTRIC CORP 发明人 OONO YOSHIKAZU;TOUGA TOSHIO
分类号 H01L21/31;H01L33/30;H01L33/44 主分类号 H01L21/31
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