| 摘要 |
1481112 Semi-conductor packages INTERNATIONAL BUSINESS MACHINES CORP 7 March 1975 [19 April 1974] 9719/75 Heading H1K In a package for IC wafers 118a,118b, the wafers are supported at their central regions and adjacent their peripheries only by carriers 117a, 117b so that they may expand or contract radially as thermal conditions change. As shown, the wafers are bonded to a central raised hub of the carriers but only ride on an annular portion joined by spokes to the hub. The package includes a base-plate 113 having terminal pins 127 which are connected to a plurality of stacking pins 133a, 133b, 133c carried by the wafer carriers 117a, 117b via a distribution card 122 having leads 132a, 132b. The pins 133 a-c each include spigot and socket portions and are connected to wafer terminals by flexible leads 145a-145c. A finned housing is sealingly engaged on the base-plate and a liquid coolant is admitted into the package. The wafer carriers 117a, 117b may be of ceramic or polyimide material. In another arrangement, the central carrier hub has a conductively lined bore for making connection to the wafer (Fig. 6, not shown). |
