发明名称 COPPER PASTE
摘要 <p>PURPOSE:To manufacture the copper paste having the fine quality at low costs by mixing the respective predetermined quantity of solid component which consists of the respective predetermined quantity of glass powder, which includes the predetermined quantity of ZnO or the like, and Cu powder and vehicle component to knead them. CONSTITUTION:In wt.%:20-10% is added to solid component:90-80%, which includes the glass powder:2-10% which consists of ZnO:50-75weight%, B2O3:10-30 weight%, SiO2:5-15weight% and PbO:5-15weight%, and furthermore, which includes Bi2 O3 powder:1-8weight% and one kind of CuO or Cu2O powder:1-8 weight% and Pd powder:0.1-1 weight 5 and the residual part thereof consists of Cu powder, to be kneaded into the paste. Furthermore, RuO2:5weight% can be included in the solid component. This copper paste has the strong adhesive strength and the fine soldering wettability even if it is burned at low temperature less than 900 deg.C and the manufacture costs thereof is low.</p>
申请公布号 JPH0346706(A) 申请公布日期 1991.02.28
申请号 JP19890181693 申请日期 1989.07.14
申请人 SHOWA DENKO KK 发明人 YAMAMOTO TOSHIYUKI;SHOJI TAKASHI
分类号 H05K1/09;C09D5/24;C09D11/00;C09D11/52;C09J9/02;C09J11/04;H01B1/16 主分类号 H05K1/09
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