| 发明名称 | Flexible printed circuit board and electronic device | ||
| 摘要 | A flexible printed circuit board having a copper foil character with good visibility and without copper foil pattern peeling. The flexible printed circuit board has a base material having optical transparency, a wiring pattern formed on one surface of the base material; a first opaque cover lay film covering a surface of the wiring pattern, a character formed on the other surface of the base material; and a second opaque cover lay film covering a surface of the character. The first opaque cover lay film has an opening portion is formed therein, and the character is formed so as to be visually recognizable through the opening portion. | ||
| 申请公布号 | US9380696(B2) | 申请公布日期 | 2016.06.28 |
| 申请号 | US201314136957 | 申请日期 | 2013.12.20 |
| 申请人 | CANON KABUSHIKI KAISHA | 发明人 | Watanabe Shinsaku |
| 分类号 | H05K1/02;H05K1/03 | 主分类号 | H05K1/02 |
| 代理机构 | Cowan, Liebowitz & Latman, P.C. | 代理人 | Cowan, Liebowitz & Latman, P.C. |
| 主权项 | 1. A flexible printed circuit board having a plurality of layers, the flexible printed circuit board comprising: a base material having optical transparency; a first wiring pattern formed on one surface of the base material; a first opaque cover lay film covering a surface of the first wiring pattern; a second wiring pattern and a character formed on the other surface of the base material; and a second opaque cover lay film covering a surface of the second wiring pattern and the character, wherein the first opaque cover lay film has an opening portion formed therein, wherein the first opaque cover lay film covers the one surface of the base material around the opening portion where the first wiring pattern is not formed, wherein the second opaque cover lay film covers the other surface of the base material where neither the second wiring pattern nor the character is formed, and wherein the opening portion is formed so that he character is visible through the opening portion. | ||
| 地址 | Tokyo JP | ||