| 摘要 |
1532592 Epoxy resin compositions ALLIED CHEMICAL CORP 11 Jan 1977 [12 Jan 1976] 00975/77 Heading C3B [Also in Division H1] Epoxy resin compositions, suitable for the encapsulation of semi-conductor devices, comprise (I) an epoxide compound containing at least two 1,2-epoxide groups; (II) a novolac hardener; (III) a catalyst; (IV) a filler; and as a flame retardant a mixture comprising (V) a reactive halogenated organic compound containing hydroxyl and/or epoxide and/or amine groups which is present so as to provide 0À5-15 parts by weight of halogen per 100 parts of the combined weight of I, II and V and (VI) Sb 2 O 3 present at 1-20 parts by weight per 100 parts of the combined weight of I, II and V. I may be a diglycidyl ether of bisphenol A. V may be a halogenated epoxy resin, e.g. a brominated diglycidyl ether of bisphenol A, halogenated bisphenol A or an aliphatic halogenated glycol. II may be a phenol- or an O-cresol-formaldehyde novolac and may be present at 5-20% by wt. of the total composition. III may be a Lewis acid or a tertiary amine. IV may comprise 50-85% by wt. of the total composition and may be tabular alumina, silica, fibre glass or mixtures thereof. |
