| 摘要 |
1,225,668. Semi-conductor devices. TEXAS INSTRUMENTS Inc. 7 June, 1968 [30 June, 1967], No. 27313/68. Heading H1K. A semi-conductor array comprises a flexible base sheet 12 of non-conductive plastics material on to one surface of which are bonded a plurality of metal strip conductors 18 and a plurality of semi-conductor chips 14, each chip having a plurality of metal contacts formed on one surface, electrical interconnections being made between the chip contacts and selected strip conductors. A further flexible sheet 16 of non-conductive plastics material having a plurality of metal strip conductors 20 bonded to one surface may be laid on the first sheet so that the two sets of conductors on the sheets cross one another and interconnections may be made as required. The semi-conductor chips 14 are positioned between the strip conductors and connect to them by means of fine jumper wires. The conductors may be of aluminium or gold, connections being made by thermo-compression bonding. Tab portions 16b extend beyond the edges of the flexible sheets 16 to allow connection to external circuits, and the whole array may be folded so that these tabs are brought into close proximity to allow short interconnections to be made between selected tabs. The array may be immersed in a non- conducting cooling fluid, and insulating sheets may be placed between the folds. The metal strip conductors can be converted to transmission lines if required by providing a metallized backing to the plastics sheets. In a further embodiment, thermocompression bonding is used to connect the metal strip conductors directly on to the electrodes of the semiconductor chips to dispense with the jumper wires. In this case the chips are disposed between the flexible plastics sheets which are disposed with their conductor bearing faces towards each other, the conductors being tailored as required, Fig. 17, not shown. Where interconnection between the strip conductors is required, thermocompression bonding is employed as before. |
