发明名称 GERMANIUM DOPED GAAS DEVICES
摘要 1479154 Lasers; ohmically contacting semiconductor devices WESTERN ELECTRIC CO Inc 3 Dec 1974 [3 Dec 1973] 52162/74 Headings H1C and H1K [Also in Division C4] A semiconductor device is made by contacting at a temperature of 700-850� C. a body consisting of one or more A 111 B v compounds with a solution comprising gallium, gallium arsenide and 20-50 atomic per cent germanium, reducing the temperature of the liquid-solid interface by at least 0�5� C. to epitaxially deposit a P type layer with a carrier concentration of at least 3�5 x 10<SP>19</SP>/cc and applying a metal layer to the P type layer to form an ohmic contact therewith. Deposition preferably starts at 800� C. and is continued to provide a layer 0�5-25� thick on which a composite electrode layer of chromium or titanium overlain with gold is conventionally deposited. A method of constructiong a heterojunction laser on a (100) oriented N + GaAs substrate is described using four different solutions to provide intermediate layers of GaAlAs and finally the P type contact layer.
申请公布号 GB1479154(A) 申请公布日期 1977.07.06
申请号 GB19740052162 申请日期 1974.12.03
申请人 WESTERN ELECTRIC CO INC 发明人
分类号 C30B19/00;C30B29/40;C30B29/42;H01L21/00;H01L21/208;H01L21/285;(IPC1-7):H01L21/20;H01S3/19 主分类号 C30B19/00
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