摘要 |
A probe for testing integrated circuit components which includes a dielectric support body, conductive arms supported by the body and with the arms including a longer arm and a shorter arm. The shorter arm is positioned above the longer arm in spaced relation thereto with each arm having an outer end connected to a conductive probe tip. The probe tip includes a downwardly positioned point for contact with a surface having an integrated circuit defined thereon and contact means are provided which cooperate with the arms and tip to transmit an electrical signal to the tip or receive a signal from the tip.
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