| 发明名称 |
METHOD OF COATING ELECTRIC PARTS OR ELECTRONIC PARTS |
| 摘要 |
<p>A process for coating electronic elements comprises the steps of (1) forcibly impregnating an element with a liquid thermosetting resin undercoat, (2) depositing a powdered coating material on the element as a topcoat by electrostatic fluidized bed dip coating the element before the undercoat is dry, and (3) curing the resin by heating.</p> |
| 申请公布号 |
JPS5278243(A) |
申请公布日期 |
1977.07.01 |
| 申请号 |
JP19750153958 |
申请日期 |
1975.12.25 |
| 申请人 |
SUMITOMO DUREZ CO |
发明人 |
KIKUGA TOYOJI;NAKAMURA MASAYUKI;GOTOU TATSUO;AMAKAWA TOUSAKU |
| 分类号 |
B05D1/24;B05D1/36;H01B3/30;H01B3/40;H01B17/62;H01B19/04;H01L21/56;H01L23/29;H01L23/31 |
主分类号 |
B05D1/24 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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