发明名称 Semiconductor wafer heat treatment furnace - has horizontal rods in furnace tube with helical grooves conveying wafers on edge
摘要 <p>Semiconductor wafers requiring heat treatment are conveyed through a horizontal furnace tube continuously, standing on edge and parallel to each other. Two rods, made of the same material as the wafers, run along the bottom of the tube. They have spiral grooves to accept the wafers and transport them through the furnace when revolved in the same direction. A very uniform temp. distribution is obtd. Mechanical stresses, induced by temp. gradients, are eliminated. The revolving wafers ensure an even contact with the reactant gas. The rate of feed can be freely selected by combining the pitch of the thread with the speed.</p>
申请公布号 DE2558041(A1) 申请公布日期 1977.06.30
申请号 DE19752558041 申请日期 1975.12.22
申请人 SIEMENS AG 发明人 GUECKEL,HELMUT,DIPL.-PHYS.;ERTL,WILHELM;SCHNECKENAICHNER,FRITZ,ING.
分类号 B65G33/06;(IPC1-7):B01J17/02;H01L21/324 主分类号 B65G33/06
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