| 摘要 |
PURPOSE:To avoid contamination on a chip caused by bonding material by arranging a planer between a coating means for bonding material and a mount ing means for a chip, so as to keep a specified gap for the upper surface of a heat sink to be conveyed. CONSTITUTION:After a heat sink 3 inserted in a tunnel furnace 1 is heated at a specified temperature while being carried along the bottom wall of the tunnel furnace 1, it is stopped at the lower position of an aperture part 6. A specified amount of fused solder 5 is dripped and spread on the upper surface of the heat sink by a dispenser 7. When the hear sink 3 passes under the planer 10, the spread fused solder 5 is flattened in a specified uniform thickness. After that, the heat sink 3 is stopped at the lower position of an aperture part 12, and a chip 13 sucked and retained by a collet 14 is mounted on the heat sink 3. Thereby the chip is mounted in the manner in which wettability for the junction surface of the chip is large and air gap is hard to generate, and solder contamination on the chip and influence of bonding material upon the collet can be eliminated even when scribing is performed.
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