| 发明名称 |
BONDING OF DISSIMILAR WORKPIECES TO A SUBSTRATE |
| 摘要 |
<p>Device leads are compliantly bonded and external leads are directly bonded to a substrate with a single stroke of a bonding tool. The external leads are comprised in a lead frame that includes a compliant medium portion for bonding the device leads.</p> |
| 申请公布号 |
CA1012802(A) |
申请公布日期 |
1977.06.28 |
| 申请号 |
CA19740206029 |
申请日期 |
1974.07.31 |
| 申请人 |
WESTERN ELECTRIC COMPANY, INCORPORATED |
发明人 |
COUCOULAS, ALEXANDER |
| 分类号 |
B23K20/02;H01L21/00;H01L21/48;H01L21/607;H01L23/498;H05K3/34 |
主分类号 |
B23K20/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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