Potted circuit using semiconductor components - has selenium diode stack forming bridge in wall slots with brought out contact strips

摘要

Encapsulation and amalgamation of semiconductor components is to produce semiconductor modules. It applies particularly to selenium diode components which are combined into 4-wave rectifiers and potted into an electrically insulated mass such as a resin. The circuit consists of a stack of 4 selenium diodes (11,21,31,41) with four terminal tags (A11, A21,A31,A41) which are joined and contacted to form a bridge circuit. The terminal tags are brought out as contact strips (Z1, Z2). The semiconductor components are inserted in a wall in parallel slots spaced at an equal distance apart. The direction of the terminals are right angles to the direction of the rows.