发明名称 Method for forming a multilayer printed circuit board
摘要 Multilayer printed circuit boards are formed by providing a plurality of board assemblies having appropriate ground, signal and voltage planes. Each assembly is built around a dimensionally stable core to enhance registration between levels and is processed in such a manner that there exists a relative dimensionally stable configuration when performing method steps important to maintain good registration. The assemblies may constitute a completed multilayer board or may be subsequently combined to provide a more complex multilayer printed circuit board.
申请公布号 US4030190(A) 申请公布日期 1977.06.21
申请号 US19760671796 申请日期 1976.03.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 VARKER, KENNETH JAMES
分类号 H05K3/00;H05K3/18;H05K3/46;(IPC1-7):B41M3/08;H05K3/08;H05K3/36 主分类号 H05K3/00
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