| 摘要 |
A composition is disclosed of a dianhydride and a tetracarboxylic acid in the proportions of about 50 to about 70 mole % dianhydride to about 30 to about 50 mole % tetracarboxylic acid, a stoichiometric amount of an aromatic diisocyanate, and a solvent for the dianhydride, the tetracarboxylic acid, and the diisocyanate. A polyimide precursor is prepared by heating the composition at about 30 DEG to 70 DEG C until the evolution of carbon dioxide substantially ceases, and then at about 30 DEG to about 100 DEG C until its viscosity is about Q to about Z6 on the Gardner-Holdt viscosity scale at 18% solids. The polyimide precursor can be spread on a substrate and cured to produce a polyimide film or coated on a wire and cured to produce a polyimide wire enamel. |
