PROCEDE POUR LE MONTAGE DE MICRO-PLAQUETTES SUR UN SUBSTRAT ET INSTALLATION POUR SA MISE EN OEUVRE

摘要

Method and apparatus to enable integrated circuit chips to be accurately mounted on substrates. Each chip is precisely positioned with respect to connecting areas on the substrates to which it is soldered. To this end, a support block is movable horizontally along a predetermined path and adapted to receive a substrate provided with at least one set of connecting areas arranged in a predetermined configuration about a center. A cutting tool having on the one hand a cutting head movable along a working axis perpendicular to the path followed by the support block is arranged to pass through a first fixed point on the said path, and on the other hand a cutting die arranged in the path of the head is arranged to receive an integrated circuit chip mounted on a support. A soldering tool is provided consisting of a soldering head movable along a working axis parallel to the working axis of the cutting tool and which passes through a second fixed point on the path followed by the support block, along with a positioning assembly whose positioning axis is parallel to the working axes and passes through a third fixed point on the path followed by the support block.