发明名称 ALUMINIUM-TANTAL-SCHICHTEN FUR DUNNSCHICHTSCHALTUNGEN, LEITERBAHNEN SOWIE DISKRETE WIDERSTANDE UND KONDENSATOREN UND VERFAHREN ZUR HERSTELLUNG DERSELBEN
摘要 <p>Al-Ta alloy films containing 2 to 20 atomic % of Ta in Al exhibit an improved temperature stability. An Al-alloy film containing 7 atomic % of Ta has a resistivity of 60 mu OMEGA cm, a temperature coefficient of resistance of +100 ppm DEG /K and a sparking potential of about 400 V when anodizing in 0.1% H3PO4. An Al-alloy film containing 15 atomic % of Ta has a specific resistance of 200 mu OMEGA cm, a temperature coefficient of resistance of -100 ppm DEG /K and a sparking potential of about 300 V when anodizing in 0.1% H3PO4. The alloy films are applied on a non-conductive substrate, as by RF-cathode sputtering in a desired thickness and are useful for thin-film circuits, discrete resistors, capacitors, etc.</p>
申请公布号 ATA889673(A) 申请公布日期 1977.06.15
申请号 AT19730008896 申请日期 1973.10.19
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人
分类号 C22C21/00;H01B1/02;H01C7/00;H01C7/06;H01C17/06;H01C17/08;H01G4/008;H01G4/40;H01L27/01;H01L49/02;H05K3/10;(IPC1-7):01G1/01 主分类号 C22C21/00
代理机构 代理人
主权项
地址