发明名称 Plated foil for liquid interface bonding of titanium
摘要 For the diffusion bonding of members of titanium and some titanium alloys, layers of Cu, Ag and Ni are deposited by plating on both sides of a sheet of etched, chemically clean, titanium or titanium alloy foil of a thickness preferably less than 0.001 inch. The plated foil is interposed between faying surfaces of the members to be bonded together, and the members, with the interposed foil, are sealed under pressure, in an inert atmosphere and under partial vacuum or hard vacuum of, for example, 10<->4Torr. The parts thus prepared are heated to brazing temperature to render liquidus plating material and thereby establish a diffusion bridge between each plated face of the foil and the adjacent faying surface of each of the members. Heating is continued to induce atomic diffusion in the zone thus established between the titanium of the foil and the members, and between the members themselves, until the diffusion zone becomes principally titanium with traces of plating materials diffused throughout.
申请公布号 US4029479(A) 申请公布日期 1977.06.14
申请号 US19760691663 申请日期 1976.06.01
申请人 ROHR INDUSTRIES, INC. 发明人 PARKER, ELMO G.
分类号 B23K1/00;B23K1/19;B23K35/00;(IPC1-7):B32B15/20 主分类号 B23K1/00
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