| 发明名称 |
MANUFACTURE OF SEMICONDUCTOR UNIT |
| 摘要 |
<p>PURPOSE:To improve measurement accuracy of coated metal layer and adhesion to semiconductor wafer as well as to prevent cracks within semiconductor wafer dicing time.</p> |
| 申请公布号 |
JPS5267964(A) |
申请公布日期 |
1977.06.06 |
| 申请号 |
JP19750144733 |
申请日期 |
1975.12.04 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
NISHIHATA MIKIO;SUZUKI TAKESHI |
| 分类号 |
H01L47/02;H01L21/28;H01L21/301;H01L21/302;H01L47/00 |
主分类号 |
H01L47/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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