| 摘要 |
<p>PURPOSE:To increase wiring forming regions of a multi-chip module and to enhance a mounting density by providing a multilayer wiring board between a semiconductor chip and a silicon circuit board. CONSTITUTION:A multi-chip module 1 provides a multilayer wiring board 5 between a semiconductor chip 4 and a silicon circuit board 6 to increase wiring forming regions, and can mount more chips 4. Thus, since the number of outer terminals (lead 10) of the module 1 can be increased, the number of input/output signals which can be simultaneously processed is increased, and the module 1 can be operated at a high speed. Further, since replacement of an improper chip after the chip 4 is mounted on the board 5 is facilitated, the manufacturing yield of the module can be improved.</p> |
