| 摘要 |
<p>Metal laminated, solderable base material for printed circuits has a fleece of pref. polyethylene terephthalate, impregnated with a pref. epoxy resin as binder. Preferably there is a metal coating on both sides. Other usable binder resins are silicone, unsaturated polyester, bisdienes or modified phenolics.</p> |
