| 摘要 |
At least two overlapping or crossing levels of electrically isolated conductors are used to interconnect regions of a microelectronic device. To minimize shorts at regions of overlap or crossing, the lower conductor is provided with a pronouncedly trapezoidal cross section to facilitate maintenance of a uniform thickness of insulation between the two conductors. To achieve this cross section, the lower conductor is made of a material which etches slower in the thickness direction than in the direction normal thereto. Typically the lower conductor may be a binary metal alloy whose composition varies with thickness or polycrystalline silicon whose doping or crystalline disorder varies with thickness. |
