发明名称 |
METHOD OF PLATING PRINTED CIRCUIT BOARD |
摘要 |
A process for manufacturing printed circuit boards wherein a layer of Nickel is plated atop a layer of copper in a pattern corresponding to a desired circuit configuration. The Nickel is used as an etch resist to remove copper from the board in the non-conductive areas. Subsequently, the Nickel is chemically activated such that it will accept a coating of solder particularly at the connection points and in the through-holes. |
申请公布号 |
JPS5265862(A) |
申请公布日期 |
1977.05.31 |
申请号 |
JP19760139417 |
申请日期 |
1976.11.19 |
申请人 |
XEROX CORP |
发明人 |
ARUFUONSO DABURIYUU KASUCHIRURO |
分类号 |
H05K1/11;H05K3/00;H05K3/06;H05K3/18;H05K3/24;H05K3/28;H05K3/34;H05K3/42 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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