| 发明名称 |
Process of tin plating by immersion |
| 摘要 |
The present invention relates to a novel immersion tin bath composition and a novel and improved method of depositing a smooth, even, metallic tin coating over metallic surfaces, providing improved solderability.
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| 申请公布号 |
US4027055(A) |
申请公布日期 |
1977.05.31 |
| 申请号 |
US19750567603 |
申请日期 |
1975.04.14 |
| 申请人 |
PHOTOCIRCUITS DIVISION OF KOLLMORGAN CORPORATION |
发明人 |
SCHNEBLE, JR., FREDERICK W. |
| 分类号 |
C23C18/18;C23C18/31;(IPC1-7):05D5/12;09D5/00 |
主分类号 |
C23C18/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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